Hybrid Conferencee

International Conference on Thermal Interface Materials and Applications (ICTIMA - 26)

22nd - 23rd July 2026 | Bharatpur, Nepal
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Conference Brochure
Sample Full Paper
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Conference Notifications:

"Be sure to check this section regularly for all Research Plus International Conference updates. We’ll keep you informed about deadlines, event details, and more important notifications."

Call for Papers Extended:
"The deadline for full paper submissions has been extended for the Research Plus International Conference in Bharatpur. Submit your research by today to participate in one of the top conferences."
Certificate of Presentation:
"Present your research and receive a Certificate of Presentation to recognise your valuable contribution to the conference."
Abstract Submissions Open:
"Abstract submissions for the Bharatpur event are now open! Don’t miss the chance to present your research. Submit now."
Networking with Global Experts:
"Engage with researchers and professionals from around the world at the Bharatpur conference. Build collaborations and gain insights from leading experts."
Keynote Speaker Sessions:
"Don’t miss our Keynote Sessions in Bharatpur, featuring global leaders and innovators sharing their knowledge."
Best Paper & Best Paper Presentation Award:
"Submit your paper and stand a chance to win the Best Paper Presentation Award. The winner will be recognized at the conference in Bharatpur."
SDG-Inspired Conference Focus:
"Our conference will highlight research that addresses global sustainability, inclusive education, and solutions for environmental challenges."

Call for Paper

The ICTIMA aims to explore emerging trends and future directions in research and innovation. It provides a collaborative platform for researchers and professionals to share ideas that shape the future of their respective domains.

The conference highlights advancements in Heat Transfer, encouraging innovative, solution-oriented research that addresses global challenges and technological evolution.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Properties of thermal interface materials
02
Applications of TIMs in electronics cooling
03
Characterization techniques for TIM performance
04
Thermal conductivity measurement methods
05
Innovative materials for thermal management
06
Impact of surface roughness on TIMs
07
Thermal interface materials in automotive applications
08
Modeling heat transfer in TIMs
09
Durability and reliability of TIMs
10
Thermal performance of adhesive materials
11
TIMs for high-power electronic devices
12
Nanomaterials in thermal interface applications
13
Heat transfer enhancement with TIMs
14
Thermal cycling effects on TIM performance
15
Future trends in thermal interface materials
16
TIMs in aerospace applications
17
Thermal management in wearable technology
18
Advanced coatings for thermal interfaces
19
Sustainability in thermal interface materials
20
Challenges in TIM integration and design