Hybrid Conferencee

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 26)

1st - 2nd August 2026 | Rome, Italy
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Conference Brochure
Sample Full Paper
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Conference Notifications:

"Be sure to check this section regularly for all Research Plus International Conference updates. We’ll keep you informed about deadlines, event details, and more important notifications."

Call for Papers Extended:
"The deadline for full paper submissions has been extended for the Research Plus International Conference in Rome. Submit your research by today to participate in one of the top conferences."
Certificate of Presentation:
"Present your research and receive a Certificate of Presentation to recognise your valuable contribution to the conference."
Abstract Submissions Open:
"Abstract submissions for the Rome event are now open! Don’t miss the chance to present your research. Submit now."
Networking with Global Experts:
"Engage with researchers and professionals from around the world at the Rome conference. Build collaborations and gain insights from leading experts."
Keynote Speaker Sessions:
"Don’t miss our Keynote Sessions in Rome, featuring global leaders and innovators sharing their knowledge."
Best Paper & Best Paper Presentation Award:
"Submit your paper and stand a chance to win the Best Paper Presentation Award. The winner will be recognized at the conference in Rome."
SDG-Inspired Conference Focus:
"Our conference will highlight research that addresses global sustainability, inclusive education, and solutions for environmental challenges."

Call for Paper

The IC-EPAE aims to explore emerging trends and future directions in research and innovation. It provides a collaborative platform for researchers and professionals to share ideas that shape the future of their respective domains.

The conference highlights advancements in Electrical and Electronics Engineering, encouraging innovative, solution-oriented research that addresses global challenges and technological evolution.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Advancements in electronics packaging technologies
02
Thermal management in electronics packaging
03
Reliability testing for electronic assemblies
04
Sustainable practices in electronics packaging
05
Integration of IoT in packaging systems
06
Challenges in electronics assembly processes
07
Quality control in electronics packaging
08
Emerging materials for electronics packaging
09
Design considerations for electronic assemblies
10
Automation in electronics manufacturing
11
Future trends in electronics packaging
12
Supply chain management for electronics assembly
13
Impact of 5G on electronics packaging
14
Electromagnetic compatibility in packaging
15
Case studies in electronics packaging engineering
16
Packaging solutions for wearable electronics
17
Robustness of electronic assemblies
18
Testing methodologies for electronics packaging
19
Industry standards for electronics packaging
20
Research directions in electronics assembly