Hybrid Conferencee

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 27)

15th - 16th June 2027 | Kampala, Uganda
Research Plus

Scientific Committee Members

The Research Plus Scientific Committee Members include experienced researchers and professionals who contribute to evaluating research quality, supporting innovation, and strengthening academic discussions.

🔶 Interested in joining this scientific panel? 👉 Join Scientific Panel