Hybrid Conferencee

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 26)

4th - 5th September 2026 | Sanliurfa, Turkey

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Conference Notifications:

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Call for Papers Extended:
"The deadline for full paper submissions has been extended for the Research Plus International Conference in Sanliurfa. Submit your research by today to participate in one of the top conferences."
Certificate of Presentation:
"Present your research and receive a Certificate of Presentation to recognise your valuable contribution to the conference."
Abstract Submissions Open:
"Abstract submissions for the Sanliurfa event are now open! Don’t miss the chance to present your research. Submit now."
Networking with Global Experts:
"Engage with researchers and professionals from around the world at the Sanliurfa conference. Build collaborations and gain insights from leading experts."
Keynote Speaker Sessions:
"Don’t miss our Keynote Sessions in Sanliurfa, featuring global leaders and innovators sharing their knowledge."
Best Paper & Best Paper Presentation Award:
"Submit your paper and stand a chance to win the Best Paper Presentation Award. The winner will be recognized at the conference in Sanliurfa."
SDG-Inspired Conference Focus:
"Our conference will highlight research that addresses global sustainability, inclusive education, and solutions for environmental challenges."

Conference Session Tracks

SDG Wheel

Aligned with

UN Sustainable Development Goals

This conference contributes to global sustainability by aligning its research discussions and academic sessions with key United Nations Sustainable Development Goals. It fosters knowledge exchange, innovation, and collaborative engagement.

SDG 7
SDG 7 Affordable and Clean Energy
SDG 9
SDG 9 Industry, Innovation and Infrastructure
SDG 11
SDG 11 Sustainable Cities and Communities
Track 01

Advancements in PCB Design and Fabrication

This track focuses on innovative techniques and methodologies in printed circuit board (PCB) design and fabrication. Participants will explore the latest trends in materials, processes, and technologies that enhance PCB performance and reliability.

Track 02

Microelectronics and VLSI Design Innovations

This session will delve into the cutting-edge developments in microelectronics and Very Large Scale Integration (VLSI) design. Researchers will present their findings on design methodologies, circuit optimization, and integration techniques that push the boundaries of miniaturization and performance.

Track 03

Embedded Systems: Challenges and Solutions

Focusing on the complexities of embedded systems, this track will address the latest research in design, implementation, and optimization. Topics will include real-time systems, software-hardware co-design, and the integration of IoT technologies.

Track 04

Signal Processing Techniques for Electronics Engineering

This session will explore advanced signal processing techniques applicable to various domains within electronics engineering. Contributions will cover algorithms, hardware implementations, and applications in communications, imaging, and control systems.

Track 05

Control Systems: Theory and Applications

This track will examine the latest theoretical advancements and practical applications in control systems engineering. Participants will discuss topics such as feedback control, adaptive systems, and the integration of AI in control strategies.

Track 06

Power Electronics: Innovations and Applications

This session will highlight recent innovations in power electronics, focusing on device technologies, circuit topologies, and applications in renewable energy systems. Researchers will present their work on efficiency improvements and reliability enhancements.

Track 07

Thermal Management in Electronics Packaging

This track addresses the critical aspects of thermal management in electronics packaging and assembly. Discussions will include modeling techniques, materials selection, and innovative cooling solutions to ensure system reliability and performance.

Track 08

Computational Modeling in Electronics Engineering

Focusing on computational modeling techniques, this session will cover simulations and analytical methods used in electronics engineering. Topics will include finite element analysis, computational fluid dynamics, and their applications in design and testing.

Track 09

Energy Efficiency in Electronics Systems

This track will explore strategies for enhancing energy efficiency in electronic systems and devices. Researchers will present methodologies for energy management, optimization techniques, and the role of energy materials in system performance.

Track 10

Testing and Verification in Electronics Engineering

This session will focus on the latest methodologies and technologies for testing and verification in electronics engineering. Topics will include design for testability, fault detection, and reliability assessment in complex electronic systems.

Track 11

Hardware Optimization and Device Fabrication Techniques

This track will cover the latest advancements in hardware optimization and device fabrication techniques. Participants will discuss novel approaches to enhance performance, reduce costs, and improve manufacturability in electronic devices.